Warpage investigation of carbon/PEEK discontinuous long fibre thin panels

Investigation of Warpage Induced on Molded Strip of Qfn Package

Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues. The main cause of warpage of area array packages is the coefficient thermal expansion (CTE) mismatch between the moulding compound and other components inside the package. The objective of this study is to investigate the warpage induced o...

optimization of the manufacturing process of natural fibre thermoplastic composites in order to minimize warpage

in this study, the effective factors on warpage in short fibre reinforced thermoplastic composites has been studied. first of all, the effective factors in manufacturing process were detected and then in order to decrease the number of experiments, the approach of design of experiments has been applied. by using micromechanics theory in composites and coefficients of thermal expansion models, a...

Investigation of Long-Term Thermal Insulation Performance of Vacuum Insulation Panels with Various Enveloping Methods

To practically apply vacuum insulation panels (VIPs) to buildings or home appliances, VIPs have demanded long-term lifespan with outstanding insulation performance. Service lives of VIPs enveloped with Al-foil and three-layer Al-metallized envelope are calculated. For Al-foil envelope, the service life is longer but edge conduction is too large compared with the Al-metallized envelope. To incre...

Long Period Fibre Gratings

Analysis of Cavity Pressure and Warpage of Polyoxymethylene Thin Walled Injection Molded Parts: Experiments and Simulations

Process analysis and simulations on molding experiments of 3D thin shell parts have been conducted. Moldings were carried out with polyoxymethylene (POM). The moldings were performed with cavity pressure sensors in order to compare experimental process results with simulations. The warpage was characterized by measuring distances using a tactile coordinate measuring machine (CMM). Molding simul...